On October 26, the CEIC 2026 & International SparkLink Alliance Industry Summit, themed "SparkLink AI · Connecting Everything Intelligently," was held at the Shenzhen Convention and Exhibition Center. At the SparkLink 3.0 standard results release session, Shi Jinglin, Chairman of the International SparkLink Alliance, jointly released the SparkLink 3.0 results with representatives from the China Academy of Information and Communications Technology, China Electronics Standardization Institute, State Radio Monitoring Center Testing Center, China National Institute of Standardization, China Automotive Technology and Research Center, China Electronic Audio Industry Association, and companies including Huawei, China Mobile, and Lenovo.
After SparkLink 1.0 defined the communication architecture and 2.0 delivered end-to-end competitiveness integrating communication, positioning, sensing, and networking, 3.0 targets all-scenario intelligent IoT, innovating toward AI, passive, and millimeter-wave directions. Since its launch in August 2025, the 3.0 standard has officially released three standards including lossless audio, with many more in development. Zhi Hao, COO and head of strategy and business development at Shanghai HiSilicon, said SparkLink SLE 3.0 will upgrade rate, coverage, and interference resistance, and the "SparkLink SLE 3.0 Technical Standard Evolution Blue Book", compiled by over 60 industry-academia-research units, will deepen 3.0 implementation.
Earlier on September 28, the State Administration for Market Regulation approved and released the "SparkLink Wireless Communication System" series of national standards, a key step from association standard to recommended national standard, effective April 1, 2027.
ICgoodFind Summary: Building on 1.0's communication architecture and 2.0's integrated communication-positioning-sensing-networking, SparkLink 3.0 points toward AI, passive, and millimeter-wave, with national standards approved—China's short-range wireless connectivity standard is moving from alliance-driven to standards-system implementation. With standards leading, the pace of chip and module follow-up will determine industrialization speed.
