Taiwan’s IC packaging and testing industry posted Q1 2026 revenue of NT$201.6 billion ($6.2B) , up 1.9% QoQ and 27.3% YoY – a strong off‑season performance. Packaging contributed NT$137.4B** (+28.5% YoY), testing **NT$64.2B (+24.5% YoY).
Driven by AI GPUs, ASICs, chiplet designs, HBM, and 2.5D/3D advanced packaging – which raise technical barriers and average selling prices – the sector is set to expand further. IEK Consulting forecasts full‑year 2026 revenue of NT$838B , up 17.8% , on continued advanced packaging tailwinds and supply chain localization.
ICgoodFind: Advanced packaging for AI fuels Taiwan’s OSAT growth – Q1 beat seasonality, and the full year outlook remains strong.
