TSMC 3nm Capacity Hits 175K Wafers/Month Yet Still Tight, H2 Price Hike Up to 15%

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TSMC’s May revenue surged to NT$416.98B ($13.5B) , up 30% YoY, a monthly record. Chairman C.C. Wei reiterated strong AI demand and vowed to avoid becoming a bottleneck.

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Despite aggressive expansion, 3nm remains in short supply. Fab 18 in Tainan saw:

  • Early 2026: ~130k wafers/month

  • Q2 2026: 160k–175k wafers/month (record high)

Yet AI demand outpaces even this. Nvidia, AMD, Google, AWS are all accelerating 3nm adoption for AI accelerators and ASICs, keeping queues long.

Supply chain sources say TSMC plans to raise 3nm prices by up to 15% in H2 2026 , with another 5–10% increase possible in 2027. The move is driven by surging AI orders, overseas fab cost pressure, and 2nm ramp‑up costs – not a single customer push.

ICgoodFind: TSMC’s maxed‑out 3nm capacity can’t satisfy AI hunger. H2 price hikes look likely, strengthening TSMC’s pricing power and impacting the whole AI chip supply chain.

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