Mitsubishi Gas Chemical (MGC) has raised prices on its entire electronic materials lineup by 30%, effective April 1. The hike covers CCL, Prepregs, and CRS – core materials for high-end chip packaging.
MGC cited rising raw material, labor, and transport costs that severely hurt profitability, making the increase unavoidable to secure stable supply.
As the global leader in BT resin (over 50% market share), MGC’s move sends ripples across the supply chain. BT resin is the critical core layer in FC-BGA and FC-CSP substrates used in CPU, GPU, and AI chip packaging.
The price jump also affects CCL, which provides mechanical support and signal integrity in advanced packages. With chips running faster and hotter, standard materials fall short – premium CCL is now a must-have for AI-grade packaging.
MGC is also developing new CCL variants tailored for next-gen AI chip substrates, further strengthening its grip on the market.
ICgoodFind:30% hike on BT resin and CCL – AI chip packaging costs just got a big push upward.
