GigaDevice (Beijing GigaDevice Semiconductor Inc.)
GigaDevice (Beijing GigaDevice Semiconductor Inc.) is a leading Fabless semiconductor design company in China, mainly manufacturing the following major categories of chip products:
1. Memory Chips (Core Product Line)
NOR Flash
- SPI NOR Flash: GD25/GD55 series, with cumulative global shipments exceeding 23.7 billion units, ranking second in the global market.
- High-performance NOR Flash: GD25LX series, with a data throughput rate of up to 400MB/s, designed specifically for high-speed code execution.
NAND Flash
- SPI NAND Flash: GD5F series, the latest 24nm process products (e.g., GD5F1GM7).
- Automotive-grade NAND: Cumulative shipments exceeding 200 million units, certified to AEC-Q100.
Specialty DRAM
- DDR3L/DDR4 products, applied in network communication, smart TVs, industrial control, and other fields.
2. Microcontroller (MCU) Chips (Second Core Business)
GD32 Series
The top brand in China’s 32-bit general-purpose MCU market, with cumulative shipments exceeding 1.98 billion units.
By Core Type
- Arm Cortex-M Series:
- M33 core: GD32G5 series (216MHz main frequency), awarded the 2025 Global Electronics Achievement Award for "MCU of the Year".
- M7 core: High-performance series, suitable for industrial automation and motor control.
- M4/M23/M0+ and other series, meeting diverse performance requirements.
- RISC-V Core: GD32V series, domestically independent instruction set MCUs.
Specialized MCUs
- Fingerprint Recognition-specific: Synergized with the company’s sensor business.
- Industry-specific series: For optical modules, printers, etc.
- Automotive-grade MCU: GD32A503 series, used in automotive motor control, BMS, and other systems.
3. Intelligent Human-Machine Interaction Sensor Chips
Touch Chips
- Self-capacitive and mutual-capacitive touch solutions, applied in smartphones, tablets, and smart homes.
Fingerprint Recognition Chips
- Ranked second in the domestic market, providing high-security biometric recognition solutions.
4. Analog Chips and Solutions
Power Management
- Linear Regulators (LDO), DC-DC converters, etc.
- High-voltage analog chips (24V/48V), used in industrial and automotive applications.
Motor Drivers
- GD30DR series: Brushed/brushless motor driver chips, adapted for humanoid robot joints and industrial automation.
- Stepper motor driver chips, enabling precise control applications.
Signal Chain
- ADC (Analog-to-Digital Converter): GD30AD series.
- Operational Amplifiers: GD30AP series.
- Comparators: GD30CP series.
- Temperature Sensors: GD30TS series.
5. System-on-Chip (SOC) Solutions
High-performance Integrated Chips
- GD30DRE508 series: SOC chips integrating drive and control functions, designed specifically for robot joints.
- Integrated solutions combining power management + MCU + communication interfaces, applied in IoT devices and consumer electronics.
Product Application Fields
| Chip Category | Main Application Scenarios |
|---|---|
| NOR Flash | Code storage, firmware upgrade, industrial control, automotive electronics |
| MCU | Industrial automation, smart home, consumer electronics, automotive electronics, humanoid robots, medical equipment |
| Sensors | Mobile terminals, PCs, biometric recognition, IoT devices |
| Analog Chips | Power management, motor control, industrial automation, automotive electronics |
Industry Position
- NOR Flash: Second in the global market, after Macronix.
- MCU: First in China’s 32-bit general-purpose MCU market, a benchmark for domestic substitution.
- Automotive-grade Chips: Certified to AEC-Q100, with cumulative shipments exceeding 200 million units, entering mainstream automotive supply chains.
Common Material Models for Engineers’ Hardware Selection
GDQ Series - DDR4 Memory
| Chip Model | Package Type |
|---|---|
| GDQ3BFAM-CJ | 96-FBGA |
| GDQ3A8AM-WI | 78-FBGA |
| GDQ2BFAA-WQ | 96-FBGA |
| GDQ2BFAA-CQ | 96-FBGA |
GD5F Series - NAND Flash
| Chip Model | Package Type |
|---|---|
| GD5F2GQ5UEYIGR | WSON-8-EP(6x8) |
| GD5F2GM7UEYIGR | WSON-8(8x6mm) |
| GD5F1GQ5UEYIGR | WSON-8(8x6mm) |
| GD5F1GQ5UEYIG | WSON-8(8x6mm) |
| GD5F1GQ5REYIGR | WSON-8(8x6mm) |
| GD5F1GQ4UBYIGR | WSON-8(8x6mm) |
| GD5F1GQ4UBYIG | WSON-8(8x6mm) |
| GD5F1GM7UEYIGR | WSON-8(8x6mm) |
GD32 Series - MCU
| Chip Model | Package Type |
|---|---|
| GD32F470ZIT6 | LQFP-144(20x20mm) |
| GD32F470VGT6 | LQFP-100(14x14mm) |
| GD32F450VET6 | LQFP-100(14x14mm) |
| GD32F450IKH6 | LQFP-144(20x20mm) |
| GD32F4501IH6 | LQFP-144(20x20mm) |
| GD32F427ZET6 | LQFP-144(20x20mm) |
| GD32F427VET6 | LQFP-100(14x14mm) |
| GD32F427RET6 | LQFP-64(10x10mm) |
| GD32F407ZGT6 | LQFP-144(20x20mm) |
| GD32F407VGT6 | LQFP-100(14x14mm) |
| GD32F407VET6 | LQFP-100(14x14mm) |
| GD32F407RET6 | LQFP-64(10x10mm) |
| GD32F405RGT6 | LQFP-64(10x10mm) |
| GD32F405RET6 | LQFP-64(10x10mm) |
| GD32F330K8U6 | TSSOP-20 |
| GD32F330CBT6 | LQFP-48(7x7mm) |
| GD32F307VCT6 | LQFP-100(14x14mm) |
| GD32F307RCT6 | LQFP-64(10x10mm) |
| GD32F305VET6 | LQFP-100(14x14mm) |
| GD32F305RBT6 | LQFP-64(10x10mm) |
| GD32F303ZET6 | LQFP-144(20x20mm) |
| GD32F303VGT6 | LQFP-100(14x14mm) |
| GD32F303VET6 | LQFP-100(14x14mm) |
| GD32F303VCT6 | LQFP-100(14x14mm) |
| GD32F303RGT6 | LQFP-64(10x10mm) |
| GD32F303RET6 | LQFP-64(10x10mm) |
| GD32F303RCT6 | LQFP-64(10x10mm) |
| GD32F303CGT6 | LQFP-48(7x7mm) |
| GD32F303CET6 | LQFP-48(7x7mm) |
| GD32F303CCT6 | LQFP-48(7x7mm) |
| GD32F303CBT6 | LQFP-48(7x7mm) |
| GD32F130G8U6TR | TSSOP-20 |
| GD32F130F8P6TR | TSSOP-20 |
| GD32F130C8T6 | LQFP-48(7x7mm) |
| GD32F105VCT6 | LQFP-100(14x14mm) |
| GD32F105RCT6 | LQFP-64(10x10mm) |
| GD32F105RBT6 | LQFP-64(10x10mm) |
| GD32F103ZET6 | LQFP-144(20x20mm) |
| GD32F103VGT6 | LQFP-100(14x14mm) |
| GD32F103VET6 | LQFP-100(14x14mm) |
| GD32F103VCT6 | LQFP-100(14x14mm) |
| GD32F103TBU6 | TSSOP-20 |
| GD32F103RET6 | LQFP-64(10x10mm) |
| GD32F103RCT6 | LQFP-64(10x10mm) |
| GD32F103RBT6 | LQFP-64(10x10mm) |
| GD32F103CBT6 | LQFP-48(7x7mm) |
| GD32F103C8T6 | LQFP-48(7x7mm) |
| GD32E230K8T6 | LQFP-48(7x7mm) |
| GD32E230C8T6 | LQFP-48(7x7mm) |
| GD32E103RBT6 | LQFP-64(10x10mm) |
| GD32E103CBT6 | LQFP-48(7x7mm) |
| GD32C103RBT6 | LQFP-64(10x10mm) |
| GD32C103CBT6 | LQFP-48(7x7mm) |
GD25 Series - NOR Flash
| Chip Model | Package Type |
|---|---|
| GD25Q80ETIGR | SOP-8 |
| GD25Q80ETIG | SOP-8 |
| GD25Q80EEIGR | SOP-8 |
| GD25Q80CSIG | USON-8 |
| GD25Q80CEIGR | SOP-8 |
| GD25Q64ESIG | SOP-8 |
| GD25Q64CSIGR | USON-8 |
| GD25Q64CSIG | USON-8 |
| GD25Q40CTIGR | SOP-8 |
| GD25Q40CTIG | SOP-8 |
| GD25Q40CEIGR | SOP-8 |
| GD25Q32EWIGR | SOP-8 |
| GD25Q32EWIG | SOP-8 |
| GD25Q32ESIGR | SOP-8 |
| GD25Q32ESIG | SOP-8 |
| GD25Q32CSIGR | USON-8 |
| GD25Q32CSIG | USON-8 |
| GD25Q256EYIGR | SOP-8 |
| GD25Q256DYIGR | SOP-8 |
| GD25Q16ETIGR | SOP-8 |
| GD25Q16ESIGR | SOP-8 |
| GD25Q16ESIG | SOP-8 |
| GD25Q16CTIGR | SOP-8 |
| GD25Q16CSIGR | USON-8 |
| GD25Q16CSIG | USON-8 |
| GD25Q128EWIGR | SOP-8 |
| GD25Q128ESIG | SOP-8 |
| GD25Q127CSIGR | USON-8 |
| GD25Q127CSIG | USON-8 |
| GD25LQ128EWIGR | SOP-8 |
| GD25LQ128ESIGR | SOP-8 |
| GD25LQ128DSIGR | SOP-8 |
| GD25LQ128DSIG | SOP-8 |
Package Type Explanation
FBGA - Fine-Pitch Ball Grid Array
Used for high-performance memory:
- 78-FBGA: 78 solder balls, suitable for x8 architecture DDR4.
- 96-FBGA: 96 solder balls, suitable for x16 architecture DDR4.
WSON-8 - Wide-body Wafer-Level Chip Scale Package (8 pins)
- Common sizes: 8x6mm or 6x5mm, with exposed pad (EP).
- Used for SPI NAND Flash; 8 pins include VCC, GND, and data interfaces.
LQFP - Low-profile Quad Flat Package
- Numbers indicate pin count (e.g., LQFP-144 = 144 pins).
- Common sizes: 20x20mm (144pin), 14x14mm (100pin), 10x10mm (64pin), 7x7mm (48pin).
TSSOP - Thin Shrink Small Outline Package
- Suitable for small-package MCUs (e.g., GD32F130 series).
SOP-8/USON-8 - Small Outline Package/Ultra-Small Outline No-Lead Package (8 pins)
- Used for SPI NOR Flash; 8 pins include SCLK, CS#, I/O0-3, etc.
Summary
- GDQ Series (DDR4): Mainly use FBGA packages (78 or 96 balls).
- GD5F Series (NAND Flash): Mainly use WSON-8 packages (8x6mm).
- GD32 Series (MCU): Mainly use LQFP packages (144/100/64/48 pins based on model).
- GD25 Series (NOR Flash): Mainly use SOP-8 or USON-8 packages.
GigaDevice’s product layout centers on the four core technology platforms of "Memory + MCU + Sensors + Analog", forming a complete industrial chain from chip design to system solutions. Its products are widely applied in consumer electronics, industrial control, automotive electronics, medical equipment, AIoT, and other fields, making it a leading enterprise in China’s semiconductor design industry.
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