Samsung is launching an aggressive pricing strategy for its 12-layer HBM3E memory, offering chips at prices roughly 30% lower than competitors. This move aims to recapture market share after the company's HBM3E faced an 18-month certification delay with NVIDIA, making it the third supplier to qualify, behind SK Hynix and Micron.
The price cut reflects Samsung's challenging position. Its late entry means it must now compete for 2026 supply contracts that its rivals have largely secured. Furthermore, its current HBM3E product requires the use of liquid-cooled AI servers, limiting its competitiveness.
Looking ahead, Samsung is applying a similar low-price strategy for its upcoming HBM4. While it has showcased competitive HBM4 specs and plans to use more advanced 1c node technology, its initial HBM4 quotes are already projected to be 6-8% lower than the competition. However, market concerns remain about the yield stability of its new node.
ICgoodFind : Samsung's price war intensifies competition in the HBM market, with the upcoming HBM4 generation set to redefine the competitive landscape.
