Model/Brand/Package
Category/Description
Inventory
Price
Data
-
![]()
Category: Classification of electronic componentsDescription: QFN Adaptics converts dual flat lead-free and quad flat lead-free packages (DFN and QFN) to dual in-line package (DIP) format using DIP pin adapters. ###The IC socket - Package adaptation series allows for the conversion from one packaging type to another. By avoiding redesigning circuit boards for spare packaging, development costs can be reduced.42631+$81.574110+$78.0274100+$77.3890250+$76.8925500+$76.11221000+$75.75752500+$75.26105000+$74.8354 -
![]()
Category: Classification of electronic componentsDescription: SOP/SSOP/TSOP/TSSOP/MSOP/QSOP Convert various small form factor packages (SOP/SSOP/TSOP/SSOP/MSOP/QSOP) to dual in line (DIP) package format to adapt to DIP adapters. ###The IC socket package Adaptics DIP series of Adaptics adapters can convert one packaging form into another packaging form without having to redesign the circuit board to match another packaging type, which can reduce development costs.76671+$293.806610+$286.142150+$280.2659100+$278.2221200+$276.6892500+$274.64531000+$273.36792000+$272.0905 -
![]()
Category: Classification of electronic componentsDescription: 0.8 mm The micro clamp micro test probe is suitable for connecting to fine pitch integrated circuits (such as QFP) with lead pitch as low as 0.4mm. Provide models of short soldering iron tips or 13mm long soldering iron tips. The probes are packaged in pairs (yellow and green) and stacked in the space of individual probes. This allows testing of adjacent integrated circuit legs. Provide female to male and female to female interconnecting wires. ###Test probes and test clips - Small test clip warning * Test wires and probes cannot be used to test circuits with voltages exceeding 50V AC unless otherwise specified. When checking live circuits, the rated value of the fuse should not exceed the rated value of the test clamp under any circumstances.67481+$218.623110+$212.919850+$208.5474100+$207.0265200+$205.8859500+$204.36501000+$203.41452000+$202.4640 -
![]()
Category: Classification of electronic componentsDescription: 0.8 mm The micro clamp micro test probe is suitable for connecting to fine pitch integrated circuits (such as QFP) with lead pitch as low as 0.4mm. Provide models of short soldering iron tips or 13mm long soldering iron tips. The probes are packaged in pairs (yellow and green) and stacked in the space of individual probes. This allows testing of adjacent integrated circuit legs. Provide female to male and female to female interconnecting wires. ###Test probes and test clips - Small test clip warning * Test wires and probes cannot be used to test circuits with voltages exceeding 50V AC unless otherwise specified. When checking live circuits, the rated value of the fuse should not exceed the rated value of the test clamp under any circumstances.16801+$48.593810+$45.8057100+$43.7344250+$43.4158500+$43.09711000+$42.73872500+$42.42005000+$42.2209 -
![]()
Category: Classification of electronic componentsDescription: 0.8 mm The micro clamp micro test probe is suitable for connecting to fine pitch integrated circuits (such as QFP) with lead pitch as low as 0.4mm. Provide models of short soldering iron tips or 13mm long soldering iron tips. The probes are packaged in pairs (yellow and green) and stacked in the space of individual probes. This allows testing of adjacent integrated circuit legs. Provide inclusive to plug-in and inclusive to inclusive interconnect wires. Test probes and test clips - Small test clips97711+$133.898010+$130.405050+$127.7270100+$126.7955200+$126.0969500+$125.16551000+$124.58332000+$124.0011 -
![]()
Category: Classification of electronic componentsDescription: 10 A gasket installation kit (attachment)13865+$30.014050+$28.7314200+$28.0131500+$27.83351000+$27.65392500+$27.44875000+$27.32047500+$27.1922
