Description:
QFN Adaptics converts dual flat lead-free and quad flat lead-free packages (DFN and QFN) to dual in-line package (DIP) format using DIP pin adapters. ###The IC socket - Package adaptation series allows for the conversion from one packaging type to another. By avoiding redesigning circuit boards for spare packaging, development costs can be reduced.
Description:
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP Convert various small form factor packages (SOP/SSOP/TSOP/SSOP/MSOP/QSOP) to dual in line (DIP) package format to adapt to DIP adapters. ###The IC socket package Adaptics DIP series of Adaptics adapters can convert one packaging form into another packaging form without having to redesign the circuit board to match another packaging type, which can reduce development costs.
Description:
DIP Socket molded and turned pins, low insertion force shrink DIP socket, pin spacing of 0.07 inches. The molded pins are tin plated phosphor bronze, and the turned pins have nickel plated internal contacts with a tin plated brass shell. # # IC socket DIP turned pins
Description:
Winslow Adaptics W30600 Series winding DIL IC socket W30600 series 3-level winding DIL IC socket with open frame housing. These DIL IC sockets have screw mechanism (turning) semi hard brass external pins with beryllium copper contacts. The contacts are gold-plated and the external pins have pure bright tin plating. These pins that are wound around DIL IC sockets have straight knurled sleeves to prevent the pins from rotating during the winding process. The frame is made of PBT and has a UL 94 V-0 rating. ###Features and advantages: Screw mechanism, contact roller sleeve, can prevent pin rotation # # # IC socket DIP turning pins
Description:
Winslow Adaptics W30600 Series winding DIL IC socket W30600 series 3-level winding DIL IC socket with open frame housing. These DIL IC sockets have screw mechanism (turning) semi hard brass external pins with beryllium copper contacts. The contacts are gold-plated and the external pins have pure bright tin plating. These pins that are wound around DIL IC sockets have straight knurled sleeves to prevent the pins from rotating during the winding process. The frame is made of PBT and has a UL 94 V-0 rating. ###Features and advantages: Screw mechanism, contact roller sleeve, can prevent pin rotation # # # IC socket DIP turning pins
Description:
Winslow Adaptics W30600 Series winding DIL IC socket W30600 series 3-level winding DIL IC socket with open frame housing. These DIL IC sockets have screw mechanism (turning) semi hard brass external pins with beryllium copper contacts. The contacts are gold-plated and the external pins have pure bright tin plating. These pins that are wound around DIL IC sockets have straight knurled sleeves to prevent the pins from rotating during the winding process. The frame is made of PBT and has a UL 94 V-0 rating. ###Features and advantages: Screw mechanism, contact roller sleeve, can prevent pin rotation # # # IC socket DIP turning pins
Description:
Winslow Adaptics W3100 The W3100 series DIL embossed IC socket adopts a compact and thin end and side stackable design, making it particularly suitable for use in high-density circuit layouts. These W3100 DIL IC sockets have tin plated double wipe contacts, providing maximum contact fixation at the lowest cost and a large lead area for easy packaging and insertion. Other features of these W3100 series embossed IC sockets include over stress protection, 35 degree angle contacts to prevent IC pins from getting stuck behind the contacts during insertion, and a working temperature range of -65 ° C →+150 ° C # # # IC socket - DIL embossed pins
Description:
0.8 mm The micro clamp micro test probe is suitable for connecting to fine pitch integrated circuits (such as QFP) with lead pitch as low as 0.4mm. Provide models of short soldering iron tips or 13mm long soldering iron tips. The probes are packaged in pairs (yellow and green) and stacked in the space of individual probes. This allows testing of adjacent integrated circuit legs. Provide female to male and female to female interconnecting wires. ###Test probes and test clips - Small test clip warning * Test wires and probes cannot be used to test circuits with voltages exceeding 50V AC unless otherwise specified. When checking live circuits, the rated value of the fuse should not exceed the rated value of the test clamp under any circumstances.
Description:
0.8 mm The micro clamp micro test probe is suitable for connecting to fine pitch integrated circuits (such as QFP) with lead pitch as low as 0.4mm. Provide models of short soldering iron tips or 13mm long soldering iron tips. The probes are packaged in pairs (yellow and green) and stacked in the space of individual probes. This allows testing of adjacent integrated circuit legs. Provide female to male and female to female interconnecting wires. ###Test probes and test clips - Small test clip warning * Test wires and probes cannot be used to test circuits with voltages exceeding 50V AC unless otherwise specified. When checking live circuits, the rated value of the fuse should not exceed the rated value of the test clamp under any circumstances.
Description:
0.8 mm The micro clamp micro test probe is suitable for connecting to fine pitch integrated circuits (such as QFP) with lead pitch as low as 0.4mm. Provide models of short soldering iron tips or 13mm long soldering iron tips. The probes are packaged in pairs (yellow and green) and stacked in the space of individual probes. This allows testing of adjacent integrated circuit legs. Provide inclusive to plug-in and inclusive to inclusive interconnect wires. Test probes and test clips - Small test clips
Description:
Winslow Adaptics W3100 The W3100 series DIL embossed IC socket adopts a compact and thin end and side stackable design, making it particularly suitable for use in high-density circuit layouts. These W3100 DIL IC sockets have tin plated double wipe contacts, providing maximum contact fixation at the lowest cost and a large lead area for easy packaging and insertion. Other features of these W3100 series embossed IC sockets include over stress protection, 35 degree angled contacts to prevent IC pins from getting stuck behind the contacts during insertion, and an operating temperature range of -65 ° C →+150 ° C for IC sockets - DIL embossed pins
Description:
Winslow Adaptics W30600 Series winding DIL IC socket W30600 series 3-level winding DIL IC socket with open frame housing. These DIL IC sockets have screw mechanism (turning) semi hard brass external pins with beryllium copper contacts. The contacts are gold-plated and the external pins have pure bright tin plating. These pins that are wound around DIL IC sockets have straight knurled sleeves to prevent the pins from rotating during the winding process. The frame is made of PBT and has a UL 94 V-0 rating. ###Features and advantages: Screw mechanism, contact roller sleeve, can prevent pin rotation # # # IC socket DIP turning pins
Description:
Winslow Adaptics W30600 Series winding DIL IC socket W30600 series 3-level winding DIL IC socket with open frame housing. These DIL IC sockets have screw mechanism (turning) semi hard brass external pins with beryllium copper contacts. The contacts are gold-plated and the external pins have pure bright tin plating. These pins that are wound around DIL IC sockets have straight knurled sleeves to prevent the pins from rotating during the winding process. The frame is made of PBT and has a UL 94 V-0 rating. ###Features and advantages: Screw mechanism, contact roller sleeve, can prevent pin rotation # # # IC socket DIP turning pins
Description:
DIP Thin and high-quality DIL socket with mechanical contacts. The internal contacts of the glass copper are nickel plated, covered with four fingers (0.3 μ m) of gold, and the brass shell is tin plated. Temperature range: -55 ° C to+125 ° C Insertion: 1000 times # # # IC socket DIP turning pins
