Encapsulation parameters/installation method: | Through Hole |
|
Other/Series: | 507 |
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Other/Product: | Power Relays |
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Other/Type: | Standard |
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Other/Matching Style: | Through Hole |
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Other/Contact Material: | Silver Tin Oxide (AgSnO) |
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Other/Contact Terminations: | Solder Pin |
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Other/Contact Form: | SPDT (1 Form C) |
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Other/Coil Voltage: | 24 VDC |
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Other/Switching Voltage: | 277 VAC |
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Other/Contact Current Ratings: | 17 A |
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Other/Power Consumption: | 530 mW |
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Other/Coil Termination: | Solder Pin |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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