Chip AI consultant
Dimensions/Height: | 9.82 mm |
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Physical parameters/materials: | Aluminum |
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Other/Type: | Passive |
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Other/cooling devices: | BGA |
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Other/fixed methods: | Clip |
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Other/Product Height: | 9.82 mm |
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Other/heat sink styles: | Radial |
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Other/Surface Treatment: | Black Anodized |
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Other/Materials: | Aluminum |
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Other/Standard Packaging: | Bulk |
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Other/Comments: | Mounting clip does not increase overall heat sink height.; Heat sink assembly i |
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Other/RoHS ELV Compliance: | RoHS compliant, ELV compliant |
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Other/Lead Free Solder Processes: | Not relevant for lead free process |
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Other/Height (in millimeters): | 9.82 [0.387] |
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Other/Diameter (mm): | 34.92 [1.375] |
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Other/Packaging Sizes (in millimeters): | 42.5 [1.675] |
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Other/Equipment Types: | BGA |
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Other/Flammability Level: | UL 94V-0 |
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Other/radiator types: | 2 Fin Radial |
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Other/Applicable to: | BGA Semiconductor Packages |
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Other/Line: | ChipCoolers |
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Other/Product Types: | Heat Sink |
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Other/RoHS ELV compliance records: | Converted to comply with RoHS directive |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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