Package parameters/number of pins: | 24 |
|
Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PALC22V10D-15JC
|
Cypress Semiconductor | 功能相似 | PLCC |
闪存可擦除,可重复编程的CMOS PAL®设备 Flash Erasable, Reprogrammable CMOS PAL㈢ Device
|
||
PALC22V10D-15PC
|
Cypress Semiconductor | 功能相似 | DIP |
闪存可擦除,可重复编程的CMOS PAL®设备 Flash Erasable, Reprogrammable CMOS PAL㈢ Device
|
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