Chip AI consultant
Technical parameters/Contact electroplating: | Gold |
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Technical parameters/Insulation resistance: | 5.00 GΩ |
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Physical parameters/contact material: | Brass |
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Other/Product Lifecycle: | Active |
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Other/Manufacturing Applications: | Medical, Sensing& Instrumentation, Aerospace, Defence, Military, Automotive, Sensing and Instrumentation, Communications& Networking, Defense, Military and Aviation, Computers& Computer Peripherals, Medical, Communications and Networks, Defense, Automotive, Military and Aviation, RF Communications, RF Communications, Computers and Computer Peripherals |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standards/military grade: | Yes |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
13-10-1 RG174
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Multicomp | 类似代替 |
MULTICOMP 13-10-1 RG174 射频/同轴连接器, BNC同轴, 直型插头, 压接, 50 ohm, RG174, 黄铜
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13-10F-1 58 TGN/Z
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Multicomp | 类似代替 |
MULTICOMP 13-10F-1 58 TGN/Z 射频/同轴连接器, BNC同轴, 直型插头, 压接, 50 ohm, RG58, 黄铜
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