Technical parameters/operating temperature (Max): | 70 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 56 |
|
Encapsulation parameters/Encapsulation: | TFSOP-56 |
|
Dimensions/Length: | 14 mm |
|
Dimensions/Width: | 6.1 mm |
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Dimensions/Height: | 1 mm |
|
Dimensions/Packaging: | TFSOP-56 |
|
Other/Product Lifecycle: | Unknown |
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Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Renesas Electronics | 完全替代 | TSSOP-56 |
3.3伏的CMOS双异步FIFO DUAL 512× 9 ,双1024× 9双2048 ×9 ,双4096 ×9 DUAL 8,192 ×9 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO DUAL 512 x 9, DUAL 1,024 x 9 DUAL 2,048 x 9, DUAL 4,096 X 9 DUAL 8,192 X 9
|
||
72V82L15PAG
|
Integrated Device Technology | 完全替代 | TSSOP-56 |
3.3伏的CMOS双异步FIFO DUAL 512× 9 ,双1024× 9双2048 ×9 ,双4096 ×9 DUAL 8,192 ×9 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO DUAL 512 x 9, DUAL 1,024 x 9 DUAL 2,048 x 9, DUAL 4,096 X 9 DUAL 8,192 X 9
|
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