Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Bulk |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Rochester | 功能相似 | DIP |
单片CMOS模拟多路复用器 Monolithic CMOS Analog Multiplexers
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