Encapsulation parameters/Encapsulation: | DIP |
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Dimensions/Packaging: | DIP |
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Other/Product Lifecycle: | Obsolete |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5962-8981503LA
|
E2V | 功能相似 | DIP |
EPROM UV 16Kbit 2K x 8 18ns 24Pin Windowed CDIP
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Cypress Semiconductor | 功能相似 | DIP |
2K ×8的可重复编程的PROM注册 2K x 8 Reprogrammable Registered PROM
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