Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
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Other/Product Lifecycle: | Unknown |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
NXP | 功能相似 | DIP-28 |
74HC/HCT7030; 9Bit x 64-word FIFO register; 3-state
|
||
CY7C409A-35PC
|
Cypress Semiconductor | 功能相似 | DIP |
64 ×8 FIFO级联64× 9级联FIFO 64 x 8 Cascadable FIFO 64 x 9 Cascadable FIFO
|
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