Encapsulation parameters/Encapsulation: | TFBGA |
|
Dimensions/Packaging: | TFBGA |
|
Other/Product Lifecycle: | Unknown |
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Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M36L0R7050T0ZAQF
|
ST Microelectronics | 功能相似 | TFBGA |
128兆位(多银行,多层次,突发)闪存32兆位( 2M ×16) PSRAM , 1.8V供应多芯片封装 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 32 Mbit (2M x16) PSRAM, 1.8V Supply Multi-Chip Package
|
||
M36W0R6040T0ZAQ
|
ST Microelectronics | 功能相似 | TFBGA |
64Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 16Mbit (1Mb x16) PSRAM, Multi-Chip Package
|
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