Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Obsolete |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PALCE20V8-25PC
|
Cypress Semiconductor | 功能相似 | DIP |
闪存可擦除,可重复编程的CMOS PAL器件 Flash Erasable, Reprogrammable CMOS PAL Device
|
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