Technical parameters/rated power: | 0.1 W |
|
Technical parameters/resistance: | 1 kΩ |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 2 |
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Encapsulation parameters/Encapsulation (metric): | 2012 |
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Encapsulation parameters/Encapsulation: | 0805 |
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Dimensions/Length: | 2 mm |
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Dimensions/Width: | 1.25 mm |
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Dimensions/Packaging (Metric): | 2012 |
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Dimensions/Packaging: | 0805 |
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Physical parameters/operating temperature: | -55℃ ~ 150℃ |
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Physical parameters/temperature coefficient: | ±2.0000 ppm/℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Vishay Precision Group | 完全替代 | 0805 |
Fixed Resistor, Metal Foil, 0.1W(1/10W), 1000Ω, 28V, 0.01% +/-Tol, 2ppm/Cel, Surface Mount, 0805, CHIP
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|
Vishay Precision Group | 完全替代 | 0805 |
Res Metal Foil 0805 1KΩ 0.01% 0.1W(1/10W) ±2ppm/℃ Molded SMD SMD Waffle Pack
|
||
|
|
Vishay Semiconductor | 完全替代 |
Res Metal Foil 0805 1KΩ 0.01% 0.1W(1/10W) ±2ppm/℃ Molded SMD SMD Waffle Pack
|
|||
|
|
Vishay Precision Group | 完全替代 | 0805 |
RESISTOR, METAL FOIL, 0.1W(1/10W), 0.01%, 2ppm, 1000Ω, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT
|
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|
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Vishay Foil Resistors | 完全替代 | 0805(2012 公制) |
RESISTOR, METAL FOIL, 0.1W(1/10W), 0.01%, 2ppm, 1000Ω, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT
|
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Vishay Semiconductor | 完全替代 |
RESISTOR, METAL FOIL, 0.1W(1/10W), 0.01%, 2ppm, 1000Ω, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT
|
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