Technical parameters/test current: | 5 mA |
|
Technical parameters/dissipated power (Max): | 500 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 2 |
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Encapsulation parameters/Encapsulation: | Mini-MELF |
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Dimensions/Packaging: | Mini-MELF |
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Physical parameters/temperature coefficient: | 1.2 mV/K |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Good-Ark Electronics | 类似代替 |
NXP BZV55-C5V6 单管二极管 齐纳, 5.6 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
|||
BZV55-C5V6
|
Philips | 类似代替 | Mini-MELF |
NXP BZV55-C5V6 单管二极管 齐纳, 5.6 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
||
BZV55-C5V6,135
|
Nexperia | 类似代替 | SOD-80 |
NXP BZV55-C5V6,135 单管二极管 齐纳, 5.6 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
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