Encapsulation parameters/installation method: | Through Hole |
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Physical parameters/contact material: | Phosphor Copper |
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Other/Connector Types: | mother base |
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Other/Installation Types: | through hole |
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Other/Termination Methods: | welding |
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Other/Subject Orientation: | right angle |
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Other/Sizes: | standard |
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Other/partitions: | yes |
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Other/main electroplating: | nickel |
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Other/Contact Materials: | phosphor bronze |
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Other/Contact Electroplating: | gold |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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