Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Obsolete |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CLC532AJP
|
National Semiconductor | 功能相似 | DIP |
高速2 : 1模拟多路复用器 High Speed 2:1 Analog Multiplexer
|
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