Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | Mini-MELF |
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Dimensions/Packaging: | Mini-MELF |
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Other/Zener impedance Zzt: | 80 Ohms |
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Other/Tolerance: | ±5% |
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Other/reverse leakage current Ir: | 0.1mA |
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Other/Operating Temperature: | -65℃~175℃ |
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Other/Packaging/Shell: | MINI-MELF |
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Other/Power: | 500mW |
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Other/power dissipation Pd: | 500W |
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Other/Zener voltage Vz: | 24V |
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Compliant with standards/RoHS standards: | Non-Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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