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Model 53398-1490

Description 1.24 wire to board CONN. WAFER ASSY FOR SMT 1.24 WIRE To BOARD CONN. WAFER ASSY FOR SMT

Brand: Molex

Packaging Surface Mount

Delivery time

Packaging method Cut Tape (CT)

Standard packaging quantity 1

5+:

$ 1.9980

25+:

$ 1.8500

50+:

$ 1.7464

100+:

$ 1.7020

500+:

$ 1.6724

2500+:

$ 1.6354

5000+:

$ 1.6206

10000+:

$ 1.5984

Price	$ 1.9980	$ 1.8500	$ 1.7464	$ 1.7020	$ 1.6724
Start batch production	5+	25+	50+	100+	500+

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Technical parameters/number of contacts:	14
Technical parameters/polarity:	Male
Technical parameters/Contact electroplating:	Tin Lead
Technical parameters/rated current:	1.00 A
Technical parameters/number of rows:	1
Technical parameters/hot wire testing standards:	Non-Compliant
Technical parameters/halogen-free state:	Not Low Halogen
Technical parameters/direction:	Vertical
Technical parameters/number of circuits:	14
Technical parameters/number of pins:	14
Encapsulation parameters/installation method:	Surface Mount
Packaging parameters/pin spacing:	1.25 mm
Dimensions/Length:	23.25 mm
Dimensions/Width:	3.7 mm
Dimensions/Height:	4.7 mm
Dimensions/Pin Spacing:	1.25 mm
Physical parameters/shell color:	Natural
Physical parameters/color:	Natural
Physical parameters/contact material:	Phosphor Bronze
Physical parameters/shell material:	Nylon
Other/Product Lifecycle:	Obsolete
Other/Packaging Methods:	Cut Tape (CT)
Other/Manufacturing Applications:	Automotive, General Motors, Industrial, Medical
Compliant with standards/RoHS standards:	Non-Compliant
Compliant with standards/lead standards:	Contains Lead
Compliant with the REACH SVHC standard:	No SVHC