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Description 2.54mm (. 100) spacing C-Grid ® Head, through-hole, double row, vertical, high temperature, cover, PEG, 26 circuit, 0.76 μ m (30 μ), gold (Au) selective electroplating, tin (Sn) PC tail electroplating 2.54mm (. 100) Pitch C-Grid ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
Product QR code
Brand: Molex
Packaging Through Hole
Delivery time
Packaging method Tube, Rail
Standard packaging quantity 1
43.63  yuan 43.63yuan
1+:
$ 53.2286
10+:
$ 50.1745
100+:
$ 47.9057
250+:
$ 47.5567
500+:
$ 47.2077
1000+:
$ 46.8150
2500+:
$ 46.4660
5000+:
$ 46.2478
Quantity
1+
10+
100+
250+
500+
Price
$53.2286
$50.1745
$47.9057
$47.5567
$47.2077
Price $ 53.2286 $ 50.1745 $ 47.9057 $ 47.5567 $ 47.2077
Start batch production 1+ 10+ 100+ 250+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(7964) Minimum order quantity(1)
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Technical parameters/polarity:

Male

 

Technical parameters/number of rows:

2

 

Technical parameters/number of pins:

26

 

Encapsulation parameters/installation method:

Through Hole

 

Physical parameters/contact material:

Copper Alloy

 

Other/Product Lifecycle:

Unknown

 

Other/Packaging Methods:

Tube, Rail

 

Other/Manufacturing Applications:

Automotive, General Motors, Medical, Lighting, Telecommunications

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

Compliant with standards/lead standards:

Lead Free

 

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