Technical parameters/digital logic level: | CMOS |
|
Technical parameters/digits: | 18 |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 56 |
|
Encapsulation parameters/Encapsulation: | TSSOP |
|
Dimensions/Height: | 1.05 mm |
|
Dimensions/Packaging: | TSSOP |
|
Other/Product Lifecycle: | Obsolete |
|
Other/Packaging Methods: | Tube |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY74FCT16823ATPACT
|
TI | 类似代替 | TFSOP-56 |
18位寄存器 18-Bit Registers
|
||
FCT162823ATPACTG4
|
TI | 类似代替 | TFSOP-56 |
18Bit D-Type Flip-Flops with 3-State Outputs 56-TSSOP -40℃ to 85℃
|
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