Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tube |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7204L20TDB
|
Renesas Electronics | 功能相似 | CDIP-28 |
Ic Mem Fifo 4K x 9 Async 28cdip
|
||
IDT7204L20SO
|
Integrated Device Technology | 功能相似 | SOIC-28 |
CMOS异步FIFO 2048× 9 , 4096 ×9 , 8192 ×9和16384 ×9 CMOS ASYNCHRONOUS FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9
|
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