Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Obsolete |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TIBPAL22V10-10CNT
|
TI | 功能相似 | DIP-24 |
高性能Impact -X é可编程阵列逻辑电路 HIGH-PERFORMANCE IMPACT-X E PROGRAMMABLE ARRAY LOGIC CIRCUITS
|
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