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Model H11L3SM
Description FAIRCHILD SEMICONDUCTOR H11L3SM Optocoupler, Schmitt Trigger, 7.5KV, SMD
Product QR code
Brand: Fairchild
Packaging DIP-6
Delivery time
Packaging method Each
Standard packaging quantity 1
7.26  yuan 7.26yuan
10+:
$ 8.7120
100+:
$ 8.2764
500+:
$ 7.9860
1000+:
$ 7.9715
2000+:
$ 7.9134
5000+:
$ 7.8408
7500+:
$ 7.7827
10000+:
$ 7.7537
Quantity
10+
100+
500+
1000+
2000+
Price
$8.7120
$8.2764
$7.9860
$7.9715
$7.9134
Price $ 8.7120 $ 8.2764 $ 7.9860 $ 7.9715 $ 7.9134
Start batch production 10+ 100+ 500+ 1000+ 2000+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(2407) Minimum order quantity(10)
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Technical parameters/rise/fall time:

100 ns

 

Technical parameters/Input voltage (DC):

1.20 V

 

Technical parameters/output voltage:

16.0 V

 

Technical parameters/output current:

0.05 A

 

Technical parameters/number of channels:

1

 

Technical parameters/number of pins:

6

 

Technical parameters/forward voltage:

1.2 V

 

Technical parameters/input current:

60.0 mA

 

Technical parameters/dissipated power:

0.25 W

 

Technical parameters/rise time:

0.1 µs

 

Technical parameters/isolation voltage:

7.5 kV

 

Technical parameters/forward current:

30 mA

 

Technical parameters/input current (Min):

30 mA

 

Technical parameters/breakdown voltage:

6 V

 

Technical parameters/forward voltage (Max):

1.5 V

 

Technical parameters/forward current (Max):

30 mA

 

Technical parameters/descent time:

0.1 µs

 

Technical parameters/operating temperature (Max):

85 ℃

 

Technical parameters/operating temperature (Min):

-40 ℃

 

Technical parameters/dissipated power (Max):

250 mW

 

Technical parameters/power supply voltage:

3V ~ 15V

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

6

 

Encapsulation parameters/Encapsulation:

DIP-6

 

Dimensions/Height:

3.53 mm

 

Dimensions/Packaging:

DIP-6

 

Physical parameters/operating temperature:

-40℃ ~ 85℃

 

Other/Product Lifecycle:

Active

 

Other/Packaging Methods:

Each

 

Compliant with standards/RoHS standards:

RoHS C

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
H11L3SM H11L3SM Fairchild 功能相似 DIP-6
ON Semiconductor 光耦 H11L3SM, 直流输入, 逻辑门输出, 6引脚 MDIP 封装
H11L3SR2M H11L3SR2M Fairchild 完全替代 DIP-6
FAIRCHILD SEMICONDUCTOR H11L3SR2M 光电耦合器, 施密特触发器输出, SMD-6
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