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Description ON SEMICONDUCTOR MC74HC4052ADG chip, 74HC CMOS logic device
Product QR code
Packaging SOIC-16
Delivery time
Packaging method Each
Standard packaging quantity 1
2.93  yuan 2.93yuan
5+:
$ 3.9555
25+:
$ 3.6625
50+:
$ 3.4574
100+:
$ 3.3695
500+:
$ 3.3109
2500+:
$ 3.2377
5000+:
$ 3.2084
10000+:
$ 3.1644
Quantity
5+
25+
50+
100+
500+
Price
$3.9555
$3.6625
$3.4574
$3.3695
$3.3109
Price $ 3.9555 $ 3.6625 $ 3.4574 $ 3.3695 $ 3.3109
Start batch production 5+ 25+ 50+ 100+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(9273) Minimum order quantity(5)
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Technical parameters/power supply voltage (DC):

6.00 V

 

Technical parameters/halogen-free state:

Halogen Free

 

Technical parameters/number of output interfaces:

8

 

Technical parameters/contact type:

4PST

 

Technical parameters/power supply current:

40 µA

 

Technical parameters/number of circuits:

2

 

Technical parameters/number of channels:

2

 

Technical parameters/number of pins:

16

 

Technical parameters/drain source resistance:

80 Ω

 

Technical parameters/dissipated power:

0.5 W

 

Technical parameters/number of logic gates:

2

 

Technical parameters/output current (Max):

25 mA

 

Technical parameters/number of inputs:

8

 

Technical parameters/operating temperature (Max):

125 ℃

 

Technical parameters/operating temperature (Min):

-55 ℃

 

Technical parameters/3dB bandwidth:

95 MHz

 

Technical parameters/dissipated power (Max):

500 mW

 

Technical parameters/power supply voltage:

2V ~ 6V

 

Technical parameters/power supply voltage (Max):

6 V

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

16

 

Encapsulation parameters/Encapsulation:

SOIC-16

 

Dimensions/Length:

10 mm

 

Dimensions/Width:

4 mm

 

Dimensions/Height:

1.5 mm

 

Dimensions/Packaging:

SOIC-16

 

Physical parameters/operating temperature:

-55℃ ~ 125℃

 

Other/Product Lifecycle:

Active

 

Other/Packaging Methods:

Each

 

Other/Manufacturing Applications:

Signal Processin

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
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