Encapsulation parameters/installation method: | Through Hole |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Box (TB) |
|
Other/Manufacturing Applications: | General |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
VISHAY | 功能相似 | Radial |
CAP ALUM 1500uF 20% 400V SNAP
|
||
|
|
VISHAY | 功能相似 | 4 |
820uF 400V 35x60mm 85 c 5000H
|
||
|
|
Vishay Semiconductor | 功能相似 | Through Hole |
CAP ALUM 1500uF 20% 400V SNAP
|
||
|
|
Vishay BC Components | 功能相似 | Through Hole |
CAP ALUM 1500uF 20% 400V SNAP
|
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