Technical parameters/number of pins: | 2 |
|
Technical parameters/dissipated power: | 500 mW |
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Technical parameters/test current: | 5 mA |
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Technical parameters/voltage regulation value: | 22 V |
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Technical parameters/operating temperature (Max): | 200 ℃ |
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Technical parameters/operating temperature (Min): | -65 ℃ |
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Technical parameters/dissipated power (Max): | 500 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 2 |
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Encapsulation parameters/Encapsulation: | SOD-80 |
|
Dimensions/Length: | 3.7 mm |
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Dimensions/Width: | 1.6 mm |
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Dimensions/Height: | 1.6 mm |
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Dimensions/Packaging: | SOD-80 |
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Physical parameters/temperature coefficient: | 17.6 mV/℃ |
|
Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Cut Tape (CT) |
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Other/Manufacturing Applications: | Industrial |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Compliant with the REACH SVHC standard: | No SVHC |
|
Compliant with standard/REACH SVHC version: | 2015/12/17 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BZV55-C22,115
|
NXP | 类似代替 | Mini-MELF |
Nexperia BZV55-C22,115 单路 齐纳二极管, 22V 5% 500 mW, 2引脚 MiniMELF封装
|
||
BZV55-C22,115
|
Nexperia | 类似代替 | SOD-80 |
Nexperia BZV55-C22,115 单路 齐纳二极管, 22V 5% 500 mW, 2引脚 MiniMELF封装
|
||
|
|
LGE | 类似代替 | SOD-80 |
MULTICOMP BZV55C22 单管二极管 齐纳, BZT55C系列, 22 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
||
|
|
EIC | 类似代替 | Mini-MELF |
MULTICOMP BZV55C22 单管二极管 齐纳, BZT55C系列, 22 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
||
BZV55C22
|
DC Components | 类似代替 |
MULTICOMP BZV55C22 单管二极管 齐纳, BZT55C系列, 22 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
|||
BZV55C22
|
Vishay Semiconductor | 类似代替 | MELF |
MULTICOMP BZV55C22 单管二极管 齐纳, BZT55C系列, 22 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
||
HEF4070BT,653
|
NXP | 功能相似 | SOIC-14 |
NXP HEF4070BT,653 异或门, HEF4000系列, 4门, 2输入, 2.4 mA, 4.5V至15.5V, SOIC-14
|
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