Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC14022BCPG
|
ON Semiconductor | 功能相似 | DIP-16 |
ON SEMICONDUCTOR MC14022BCPG 芯片, 逻辑芯片 - ECL, 计数器
|
||
TC4022BP
|
Toshiba | 功能相似 | DIP |
C2MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
|
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