Technical parameters/Contact electroplating: | Gold, Gold over Nickel |
|
Encapsulation parameters/installation method: | Vertical |
|
Physical parameters/contact material: | Beryllium Copper |
|
Other/Product Lifecycle: | Obsolete |
|
Other/Packaging Methods: | Box, Tube |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review