Technical parameters/rise/fall time: | 3.2µs, 4.7µs |
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Technical parameters/Input voltage (DC): | 1.05 V |
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Technical parameters/output voltage: | ≤30.0 V |
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Technical parameters/number of circuits: | 1 |
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Technical parameters/number of channels: | 1 |
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Technical parameters/forward voltage: | 1.07 V |
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Technical parameters/dissipated power: | 250 mW |
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Technical parameters/rise time: | 3 µs |
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Technical parameters/isolation voltage: | 2500 Vrms |
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Technical parameters/forward current: | 60 mA |
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Technical parameters/output voltage (Max): | 30 V |
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Technical parameters/forward voltage (Max): | 1.3 V |
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Technical parameters/forward current (Max): | 60 mA |
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Technical parameters/descent time: | 3 µs |
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Technical parameters/operating temperature (Max): | 100 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 250 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 5.13 mm |
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Dimensions/Width: | 4.16 mm |
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Dimensions/Height: | 3.43 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 100℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Customs information/ECCN code: | EAR99 Alternative material
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