Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
Customs information/ECCN code: | 3A001 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT7130LA100CGI
|
Integrated Device Technology | 功能相似 | DIP |
高速1K ×8双端口静态SRAM HIGH SPEED 1K X 8 DUAL-PORT STATIC SRAM
|
||
IDT7130SA100CB
|
Integrated Device Technology | 功能相似 | DIP |
HIGH -SPEED 1K ×8双端口静态RAM HIGH-SPEED 1K x 8 DUAL-PORT STATIC RAM
|
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