Chip AI consultant
Technical parameters/power supply voltage (DC): 3.30 V
Technical parameters/number of pins: 56
Technical parameters/dissipated power: 1610 mW
Technical parameters/data rate: 1.80 Gbps
Technical parameters/input voltage (Max): 0.1 V
Technical parameters/input voltage (Min): 0.1 V
Technical parameters/input current (Min): 10 μA
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): -10 ℃
Technical parameters/dissipated power (Max): 1610 mW
Technical parameters/power supply voltage: 3V ~ 3.6V
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: TSSOP-56
External dimensions/length: 14 mm
External dimensions/width: 6.1 mm
External dimensions/height: 0.9 mm
External dimensions/packaging: TSSOP-56
Physical parameters/operating temperature: -10℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Each
Other/Manufacturing Applications: Video and visual, imaging
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/06/15
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS90CF384AMTD
|
National | 类似代替 |
LVDS 接口集成电路
|
|||
DS90CF384AMTDX/NOPB
|
TI | 类似代替 | TSSOP-56 |
+3.3V LVDS 接收器 24 位平板显示器 (FPD) 链路 - 65MHz 56-TSSOP -10 to 70
|
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