Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-32
External dimensions/packaging: SOIC-32
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TDA8932T
|
NXP | 功能相似 | SOIC-32 |
音频放大器 2X15W BTL CLASS D AMP+VOLCTRL
|
||
TDA8932T/N1,112
|
NXP | 功能相似 | SOIC-32 |
Amplifier IC 1Channel (Mono) or 2Channel (Stereo) Class D 55W x 1 @ 8Ω; 26.5W x 2 @ 4Ω 32-SO
|
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