Technical parameters/power supply current: 28 mA
Technical parameters/number of channels: 1
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/dissipated power (Max): 300 mW
Technical parameters/power supply voltage: 1.2 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 81
Encapsulation parameters/Encapsulation: SOT-643-1
External dimensions/packaging: SOT-643-1
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Other/Manufacturing Applications: PCI Express MAX To PCI Express PHY
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PX1011B-EL1/G,551
|
NXP | 完全替代 | LFBGA-81 |
Telecommunications, NXP ### 以太网通信 一系列以太网通信控制器、收发器和交换 IC
|
||
PX1011B-EL1/G,557
|
NXP | 完全替代 | LFBGA-81 |
PHY 1CH 1.2V/2.5V/3.3V 81Pin LFBGA Tray
|
||
PX1011B-EL1/N,551
|
NXP | 完全替代 | LFBGA-81 |
PHY 1CH 1.2V/2.5V/3.3V 81Pin LFBGA Tray
|
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