Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 5
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
NC7SZU04P5X
|
ON Semiconductor | 功能相似 | SC-70-5 |
非门, 1输入, 1门, 1.65V至5.5V, SC-70-5
|
||
|
|
Fairchild | 功能相似 | TSSOP |
TinyLogic UHS Unbuffered Inverter
|
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