Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 5
Encapsulation parameters/Encapsulation: USV
External dimensions/packaging: USV
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TC7SZ08FU
|
Toshiba | 功能相似 | SOT-353 |
IC 与门 TC7SZ08FU SOT-353/USV marking/标记 J2
|
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