Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LSSOP
External dimensions/packaging: LSSOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TC7S04F(T5L,F,T)
|
Toshiba | 功能相似 | SSOP-5 |
Inverter 1Element CMOS 5Pin SMV T/R
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review