Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74AHC373PW,118
|
Dialog | 功能相似 |
NXP 74AHC373PW,118 芯片, 锁存器, D型, 透明, 三态, TSSOP-20
|
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SN74AHC373PW
|
TI | 功能相似 | TSSOP-20 |
TEXAS INSTRUMENTS SN74AHC373PW 芯片, 逻辑电路 - 八D型锁存器
|
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