Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-20
External dimensions/packaging: TSSOP-20
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC74AC377DTR2G
|
ON Semiconductor | 功能相似 | TSSOP-20 |
八路D触发器与时钟使能 Octal D Flip−Flop with Clock Enable
|
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