Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: SOP-14
External dimensions/packaging: SOP-14
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TC74HC14AP(F)
|
Toshiba | 功能相似 | DIP-14 |
TC74HC 系列,Toshiba 工艺:CMOS 工作电压范围:2.0 至 6.0 V ### 74HC 系列
|
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