Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: TSOP1
External dimensions/packaging: TSOP1
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
NAND01GW3B2BN6
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ST Microelectronics | 功能相似 | TSOP1 |
1千兆, 2千兆, 2112字节/ 1056字页, 1.8V / 3V , NAND闪存 1 Gbit, 2 Gbit, 2112 Byte/1056 Word Page, 1.8V/3V, NAND Flash Memory
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ST Microelectronics | 功能相似 | TSOP1 |
1千兆, 2千兆, 2112字节/ 1056字页, 1.8V / 3V , NAND闪存 1 Gbit, 2 Gbit, 2112 Byte/1056 Word Page, 1.8V/3V, NAND Flash Memory
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