Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: PDIP-8
External dimensions/packaging: PDIP-8
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Telcom Semiconductor | 类似代替 | DIP |
MICROCHIP TC4421CPA.. 双功率芯片, 低压侧, 4.5V-18V电源, 9A输出, 33ns延迟, DIP-8
|
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TC4421CPA
|
Microchip | 类似代替 | PDIP-8 |
MICROCHIP TC4421CPA.. 双功率芯片, 低压侧, 4.5V-18V电源, 9A输出, 33ns延迟, DIP-8
|
||
TC4422AVPA
|
Microchip | 类似代替 | PDIP-8 |
MICROCHIP TC4422AVPA 双路驱动器芯片, MOSFET, 低压侧, 4.5V-18V电源, 10A输出, 42ns延迟, DIP-8
|
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TC4452VOA
|
Microchip | 类似代替 | SOIC-8 |
MICROCHIP TC4452VOA 双路驱动器芯片, MOSFET, 驱动器, 低压侧, 4.5V-18V电源, 13A输出, 44ns延迟, SOIC-8
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