Technical parameters/RAM size: 224K x 8
Technical parameters/dissipated power: 1800 mW
Technical parameters/dissipated power (Max): 1800 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 416
Encapsulation parameters/Encapsulation: BGA-416-10
External dimensions/packaging: BGA-416-10
Physical parameters/operating temperature: -40℃ ~ 125℃ (TA)
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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