Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: MSOP
External dimensions/packaging: MSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TC622VOA
|
Micrel | 功能相似 | SOIC-8 |
TC622 系列 18 V 低成本 单 跳变点 温度传感器 - SOIC-8
|
||
TC622VOA
|
Microchip | 功能相似 | SOIC-8 |
TC622 系列 18 V 低成本 单 跳变点 温度传感器 - SOIC-8
|
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