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Model 72T36115L6-7BB
Description FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 128K x 36 240Pin BGA
Product QR code
Brand: Integrated Device Technology
Packaging BGA-240
Delivery time
Packaging method Tray
Standard packaging quantity 1
778.39  yuan 778.39yuan
1+:
$ 887.3600
10+:
$ 856.2246
50+:
$ 852.3327
100+:
$ 848.4407
150+:
$ 842.2137
250+:
$ 836.7650
500+:
$ 831.3162
1000+:
$ 825.0892
Quantity
1+
10+
50+
100+
150+
Price
$887.3600
$856.2246
$852.3327
$848.4407
$842.2137
Price $ 887.3600 $ 856.2246 $ 852.3327 $ 848.4407 $ 842.2137
Start batch production 1+ 10+ 50+ 100+ 150+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(7516) Minimum order quantity(1)
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Technical parameters/access time: 12ns, 3.8ns

Technical parameters/power supply voltage: 2.375V ~ 2.625V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 240

Encapsulation parameters/Encapsulation: BGA-240

External dimensions/length: 19.0 mm

External dimensions/width: 19.0 mm

External dimensions/packaging: BGA-240

External dimensions/thickness: 1.76 mm

Physical parameters/operating temperature: 0℃ ~ 70℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: Non-Compliant

Compliant with standards/lead standards: Contains Lead

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
IDT72T36115L5BBI IDT72T36115L5BBI Integrated Device Technology 功能相似 BGA
2.5伏高速TeraSyncTM FIFO的36位配置 2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 36-BIT CONFIGURATIONS

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